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AssigneeSeiko Epson Corporation
InventorHidekazu Kobayashi
Estimating the term…
In a method of treating a substrate for water repellency, there is a method of coating with a fluor-alkyl processing agent in the atmosphere or in a vacuum, however this takes time, and foreign matter becomes attached. A substrate surface is irradiated with ultraviolet light while flowing a fluoridated gas thereover to treat for water repellency. Moreover a thin film is formed inside a partition by this method and an organic EL device if manufactured by a liquid phase method. To be specific, scrub cleaning, UV ozone cleaning, an ultraviolet fluoridization process, an organic film forming is performed using an ink jet method, a cathode film forming and a sealing are performed.
A method of treatment for water repellency for treating the surface of a substrate for water repellency, wherein ultraviolet irradiation is performed in a state where the substrate is exposed in an atmosphere of a fluoride-containing gas.
A thin film forming method for forming a thin film in a predetermined region on a substrate, comprising:
A thin film forming method for forming a laminate of thin film in a predetermined region on a substrate, comprising:
A manufacturing method of an organic EL device having a structure in which at least a luminescent layer is sandwiched between a first electrode and a second electrode, wherein a resin bank is formed on a substrate so as to surround the first electrode pattern, the surface of this substrate is irradiated with ultraviolet light while exposed in an atmosphere of oxygen-containing gas, and is then irradiated with ultraviolet light while exposed in an atmosphere of fluoridated gas, then positive hole injection material and/or luminescent material films are formed, then subsequently a cathode forming process, and furthermore a sealing process are performed.
Dependencies are inferred from the claim text.