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US 2003/0143104 A1Published application
Solder alloy and soldered bond
AssigneeFujitsu Limited
InventorsMasayuki Kitajima, Tadaaki Shono, Masakazu Takesue, Yutaka Noda
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Abstract
A solder alloy having a solderability comparable to that of a conventional Pb—Sn solder alloy without having a detrimental effect on the environment and a soldered bond using the same. A solder alloy consisting of Zn: 4.0-10.0 wt %, In: 1.0 to 15.0 wt %, Al: 0.0020 to 0.0100 wt %, and the balance of Sn and unavoidable impurities. A soldered bond of an electric or electronic device composed of the above solder alloy.
Claims3
A solder alloy consisting of Zn:
- 4.0-10.0 wt %, In:
- 1.0 to 15.0 wt %, Al:
- 0.0020 to 0.0100 wt %, and the balance of Sn and unavoidable impurities.
Dependencies are inferred from the claim text.