US 2003/0143103 A1Published application

Die-bonding solder materials

AssigneeYamatake Corporation

InventorTAKASHI MASUDA

Life of this patent

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Abstract

A die-bonding solder material according to the present invention is so arranged as to be an eutectic including tin and gold with such a substantial composition ratio as having the eutectic point with a more content of tin than the content that of gold.

Claims7

Dependent claims

1) a die-bonding solder material characterized by comprising tin and gold with such a substantial composition ratio as having the eutectic point with a more content of tin than the content of gold:

Dependencies are inferred from the claim text.

Facts

Application: 09/445,022Filed 30 Nov 1999
Priority: JP 83756/199831 Mar 1998
Published: 31 Jul 2003
Term ends: Not estimatedThe source records don’t support an estimate.

Classification5 codes

H10W 72/20
Interconnections or connectors in packages: bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
H10W 70/681
Shapes or dispositions thereof: comprising holes not having chips therein, e.g. for outgassing, underfilling or bond wire passage
H10W 90/753
Of bond wires: between laterally-adjacent chips
H10W 90/754
Of bond wires: between a chip and a stacked insulating package substrate, interposer or RDL

Family

US 6,656,422 B2Related patent
US 2003/0143103 A1This patent

From the US filing history. Foreign family members aren’t listed.

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