LED module and methods for producing and using the module

A method for producing an LED module, which comprises:

• applying two mutually insulated metal areas, which are suitable as an etching mask, on a glass disk;
• structuring the glass disk by anisotropic wet-chemical etching to produce a glass body;
• fixing the glass body on a substrate made of silicon by anodic bonding, and using the metal areas to impress a current required for the anodic bonding;
• and
• fixing at least one semiconductor component on the substrate and fixing the substrate on a carrier body.

A method for producing an LED module, which comprises:

• applying a plurality of masking areas on a glass disk such that a plurality of etching masks are present in a chessboard-like configuration on the glass disk, each one of the plurality of the etching masks corresponding to a glass body;
• simultaneously structuring a plurality of glass bodies on the glass disk to produce a plurality of contiguous glass bodies;
• planarly fixing the glass disk on a silicon wafer to produce a silicon-glass wafer;
• fixing a plurality of semiconductor components in depressions of a glass body on a corresponding silicon wafer section;
• cutting up the silicon-glass wafer perpendicular to a plane of the wafer along lines that separate the plurality of the glass bodies from one another;
• and
• fixing the silicon wafer section having the plurality of the semiconductor components on a carrier body.

A method of using an LED module, which comprises:

• providing an LED module including:
• a thermally conductive substrate having a top side and an underside;
• at least one radiation-emitting semiconductor component fixed on the top side of the substrate;
• a carrier body having a high thermal capacity, the underside of the substrate fixed on the carrier body;
• a first component fixing located between the semiconductor component and the substrate;
• and a second component fixing located between the substrate and the carrier body, the first component fixing and the second component fixing each having a good thermal conductivity such that heat produced during operation is dissipated via the carrier body;
• and
• using the LED module to laterally couple light into an optical waveguide.