Method of manufacturing semiconductor device and apparatus of automatically adjusting semiconductor pattern
AssigneeSony Corporation
InventorsNaoyasu Adachi, Katsuya Suzuki, Masayuki Noguchi
Life of this patent
Estimating the term…
Loading patent…
AssigneeSony Corporation
InventorsNaoyasu Adachi, Katsuya Suzuki, Masayuki Noguchi
Estimating the term…
A method of manufacturing a semiconductor device and an apparatus of automatically adjusting a semiconductor pattern can precisely correct a difference in the shape or position of a pattern exposed or formed in two exposure steps. A pattern measuring unit measures an offset between the first pattern and the second pattern in a pattern measuring step. Based on the information on the offset thus detected, the first pattern is adjusted in a first patterning step with a high degree of freedom in the next manufacturing step cycle of a semiconductor device to precisely align the shape or position of the first pattern with the second pattern in a second patterning step with a low degree of freedom.
A method of manufacturing a semiconductor device, comprising the steps of:
The method of manufacturing a semiconductor device according to claim l, wherein
An apparatus of automatically adjusting a semiconductor exposure pattern for use in a process of manufacturing a semiconductor device comprising the steps of:
Dependencies are inferred from the claim text.