Bubble-jet type ink-jet printhead and manufacturing method thereof

A method of manufacturing a bubble-jet type ink-jet printhead, the method comprising the steps of:

• forming a nozzle plate on a surface of a substrate;
• forming a heater on the nozzle plate;
• etching a bottom side of the substrate and forming a manifold for supplying ink;
• forming an electrode electrically connected to the heater on the nozzle plate;
• etching the nozzle plate and forming a nozzle having a diameter less than that of the heater on the inside of the heater;
• forming an adiabatic layer on the heater;
• etching the substrate exposed by the nozzle and forming an ink chamber;
• and
• etching the substrate and forming an ink channel for supplying ink from the manifold to the ink chamber.

A bubble-jet type ink-jet printhead formed on a silicon-on-insulator (SOI) wafer having a first substrate, an oxide layer stacked on the first substrate, and a second substrate stacked on the oxide layer, the bubble-jet type ink-jet printhead comprising:

• a manifold for supplying ink, an ink chamber having a substantially hemispherical shape filled with ink to be ejected, and an ink channel for supplying ink from the manifold to the ink chamber, wherein the manifold, the ink chamber, and the ink channel are integrally formed on the first substrate;
• a nozzle, formed at a location of the oxide layer and the second substrate corresponding to a central portion of the ink chamber, for ejecting ink;
• an adiabatic barrier formed on the second substrate for forming a heater centered around the nozzle by limiting a portion of the second substrate;
• a heater protective layer stacked on the second substrate for protecting the heater;
• and
• an electrode, formed on the heater protective layer and electrically connected to the heater, for applying current to the heater.

A method of manufacturing a bubble-jet type ink-jet printhead using a silicon-on-insulator (SOI) wafer, the method comprising:

• preparing the SOI wafer having a first substrate, an oxide layer stacked on the first substrate, and a second substrate stacked on the oxide layer;
• etching the second substrate and forming an adiabatic barrier having a groove defining a heater;
• forming a heater protective layer on the second substrate for protecting the heater and sealing the adiabatic barrier;
• forming an electrode electrically connected to the heater on the heater protective layer;
• etching a bottom side of the first substrate and forming a manifold for supplying ink;
• sequentially etching the heater protective layer, the second substrate, and the oxide layer on the inside of the heater with a diameter less than that of the heater and forming a nozzle;
• etching the first substrate exposed by the nozzle and forming an ink chamber having a substantially hemispherical shape;
• and
• etching the first substrate and forming an ink channel for supplying ink from the manifold to the ink chamber.