Multiple contact vertical probe solution enabling kelvin connection benefits for conductive bump probing
AssigneeTexas Instruments Incorporated
InventorsScott W. Mitchell, Reynaldo M. Rincon, Jerry Broz, Gerard Laugler
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Abstract
Apparatus and methods for testing conductive bumps or target test points on integrated circuits comprising a multiplicity of probes extending through a support substrate. At least one of the multiplicity of probe locations including a second electrically isolated probe such that the test point is in contact with two probes. One of the two probes providing a voltage to the test point and the second probe sensing the voltage so as to provide a Kelvin connection.
Claims22
Apparatus for simultaneously making electrical contact with an array of contact points having a first selected pattern on a circuit, comprising:
- a support substrate having a working surface and a back side, said support substrate defining a multiplicity of apertures extending from said backside through said substrate and terminating at said working surface according to a second selected pattern corresponding to a mirror image of said first selected pattern;
- a multiplicity of conductive probes, said conductive probes extending from a first end at said back side of said support structure, through said apertures to a contact end located a selected distance beyond said working surface;
- at least one aperture of said multiplicity of apertures including at least two conductive probes extending there-through;
- a multiplicity of conductive pathways extending from said first end of said conductive probes to selected circuitry;
- and
- said conductive probes positioned through said support substrate to make electrical contact with contact points on a circuit placed against said apparatus.
Apparatus for simultaneously making electrical contact with an array of contact points positioned according to a first selected pattern on a circuit comprising:
- an insulating support substrate having a working surface and a back side;
- a multiplicity of conductive probes, each of said conductive probes extending from a first end at said backside of said substrate, through said substrate to a contact end, contact ends of said multiplicity of conductive probes extending a selected distance beyond said working surface and terminating at a multiplicity of locations arranged according to a second selected pattern corresponding to a mirror image of said first selected pattern;
- at least two conductive probes of said multiplicity of having their ends adjacent each other at a single one of said multiplicity of locations;
- and
- said contact ends of said conductive probes positioned through said support substrate to make electrical contact with selected ones of said contact points on a circuit placed against said apparatus.
A method of manufacturing apparatus for simultaneously making electrical contact with an array of contact points on circuitry, said circuitry having said array of contact points positioned according to a first selected pattern, comprising the steps of:
- providing a support substrate having a working surface and a backside;
- defining a multiplicity of apertures extending from said backside through said substrate and terminating at said working surface according to a second selected pattern, said second selected pattern corresponding to a mirror image of said first selected pattern;
- extending a multiplicity of first conductive probes through said multiplicity of apertures such that a first end is at said back side and a contact end extends a selected distance beyond said working surface;
- extending a second conductive probe having a first end and a contact end through at least one of said multiplicity of apertures;
- and
- positioning said multiplicity of apertures such that said contact ends of said conductive probes are aligned to make electrical contact with at least a portion of said array of contact points of a circuit placed against said apparatus.
The method of manufacturing apparatus for simultaneously making electrical contact with an array of contact points on circuits having said array of contact points positioned according to a first selected pattern comprising the steps of:
- providing a support substrate having a backside and a working surface;
- extending a multiplicity of first conductive probes through said support substrate, each of said first conductive probes extending from a first end at said backside of said substrate, through said substrate to a contact end, said contact ends of said conductive probes extending a selected distance beyond said working surface and terminating at a multiplicity of locations according to a second selected pattern corresponding to a mirror image of said first selected pattern;
- extending at least one second conductive probe having a first end and a contact end through said substrate, said contact end of said at least one second conductive probe terminating adjacent the contact end of one of said multiplicity of first conductive probes;
- and
- positioning said contact ends such that said conductive probes are aligned so as to make electrical contact with said array of contact points of a circuit placed against said apparatus.
Apparatus for contacting a target test point having an area of a first size on an integrated circuit comprising:
- a substrate;
- and
- at least two electrically isolated probes supported by said substrate located within an area of a second size for simultaneously contacting said target test point.
A process for providing a voltage at a target test point on an integrated circuit comprising the steps of:
- contacting said target test point with first and second probes;
- applying a voltage to said target test point through said first probe;
- sensing a voltage at said target test point through said second probe;
- and
- adjusting said voltage applied through said first probe until a selected voltage is sensed by said second probe.
Dependencies are inferred from the claim text.