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US 2003/0141605 A1Published application
Method of forming identifying mark on semiconductor wafer
AssigneeSilicon Integrated Systems Corp.
InventorsShyh-Dar Lee, Chen-Chiu Hsue
Life of this patent
Estimating the term…
Abstract
A method of forming an identifying mark on a semiconductor wafer. The identifying mark, for example a bar code or a character of patterns or words, is formed on the side wall of the semiconductor wafer to avoid contamination and the creation of failure dies during the formation of the identifying mark.
Claims8
A method of forming an identifying mark on a semiconductor wafer, comprising:
- providing a semiconductor wafer comprising a top face, a reverse face, and a side wall;
- forming an identifying mark on the side wall of the semiconductor.
Dependencies are inferred from the claim text.