Wiring board, semiconductor device, and method of manufacturing wiring board

A wiring substrate comprising:

• an insulating base having a wiring region and a semiconductor element mounting region;
• a connection hole formed in the wiring region and extending between the first and second main surfaces of the insulating base;
• and
• a wiring layer having one end thereof connected to the connection hole on the first main surface of the insulating base and the other end thereof positioned on the semiconductor element mounting region.

A wiring substrate comprising:

• an insulating base having a wiring region and a semiconductor element mounting region;
• a buried conductor provided in the wiring region and extending between the first and second main surfaces of the insulating base;
• and
• a wiring layer having one end thereof electrically connected to the buried conductor on the first main surface of the insulating base and the other end thereof positioned on the semiconductor element mounting region.

A semiconductor device comprising:

• a first insulating base having a wiring region and a semiconductor element mounting region;
• a first connection hole formed in the wiring region and extending between a first main surface and a second main surface of the first insulating base;
• a first wiring layer provided on the first main surface of the first insulating base, having one end thereof connected to the first connection hole and the other end thereof positioned in the semiconductor element mounting region;
• and
• a first semiconductor element positioned on the semiconductor element mounting region and connected to the first wiring layer.

A semiconductor device comprising:

• a first insulating base having a wiring region and a semiconductor element mounting region;
• a first buried conductor provided in the wiring region and extending between a first main surface and a second main surface of the first insulating base;
• a first wiring layer provided on the first main surface of the first insulating base, having one end thereof connected to the first buried conductor and the other end thereof positioned in the semiconductor element mounting region;
• and
• a first semiconductor element connected to the first wiring layer at the semiconductor element mounting region.

A method of manufacturing a wiring substrate comprising:

• forming a front conductive layer on a rear conductive layer;
• selectively removing a part of the rear conductive layer and forming a buried conductor;
• forming an insulating base in contact with the front conductive layer, the insulating substrate extending at least around the buried conductor;
• selectively thinning a part of the front conductive layer;
• selectively thinning a part of the buried conductor;
• and
• patterning the selectively thinned front conductive layer and forming a wiring and a terminal.