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AssigneeTexas Instruments Incorporated
InventorsEdgar R. Zuniga-Ortiz, Sreenivasan K. Koduri
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A semiconductor chip having a planar active surface including an integrated circuit protected by an inorganic overcoat; the circuit has metallization patterns including a plurality of contact pads. Each of these contact pads has an added conductive layer on the circuit metallization. This added layer has a conformal surface adjacent the chip, including peripheral portions of the overcoat, and a planar outer surface; this outer surface is suitable to form metallurgical bonds without melting. The chip contact pads may have a distribution arrayed in the center of the chip in close proximity to the chip neutral line; the distribution may leave an area portion of the active chip surface available for attaching a thermally conductive plate. The chip may further have a non-conductive adhesive layer over the overcoat, filling the spaces between the added conductive layers on each contact pad.
A semiconductor device comprising:
A semiconductor device comprising:
A semiconductor assembly comprising:
A method for fabricating a semiconductor device comprising a semiconductor chip having a planar active surface including an integrated circuit protected by an inorganic overcoat, and a metallization pattern including a plurality of contact pads, comprising the step of:
A method for fabricating a semiconductor assembly comprising the steps of:
Dependencies are inferred from the claim text.