Dual cure B-stageable underfill for wafer level
AssigneeNational Starch and Chemical Investment Holding Corporation
InventorsBodan Ma, Sun Hee Hong, Quinn K. Tong
Life of this patent
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Abstract
A silicon wafer has a B-stageable underfill material deposited on the active face of the wafer. The B-stageable underfill comprises a first composition with a lower curing temperature and a second composition with a higher curing temperature, characterized in that the first composition has been fully cured.
Claims12
A silicon wafer having a B-stageable underfill material deposited on one face of the wafer, the B-stageable underfill comprising two chemical compositions, a first composition and a second composition, having curing temperatures or curing temperature ranges sufficiently separated to allow the composition with the lower curing temperature, the first composition, to cure without curing the composition with the higher curing temperature, the second composition, characterized in that the first composition has been cured and the second composition is uncured.
A B-stageable underfill composition comprising comprising two chemical compositions, a first composition and a second composition, having curing temperatures or curing temperature ranges sufficiently separated to allow the composition with the lower curing temperature, the first composition, to cure without curing the composition with the higher curing temperature, the second composition.
Dependencies are inferred from the claim text.