Under bump structure and process for producing the same
OwnerChih-Hsiang Hsu, Shih-Kuang Chen +2inventors
InventorsChih-Hsiang Hsu, Shih-Kuang Chen, Chia-Hung Cheng, Min-Lung Huang
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Abstract
The present invention relates to an under bump structure comprising a wafer surface including a plurality of pads; a plurality of passivation layers covering the wafer surface around the pads; a dielectric layer covering the wafer surface and the passivation layers, each of the passivation layer and the dielectric layer having a first opening at a position corresponding to that of each pad for exposing the pad; and an under bump metallurgy layer covering the dielectric layer, the pads and the passivation layers to connect the pads.
Claims15
An under bump structure comprising:
- a wafer surface including a plurality of pads;
- a plurality of passivation layers, each passivation layer covering the wafer surface around the pads;
- a dielectric layer covering the wafer surface and the passivation layer, each of the passivation layer and the dielectric layer having a first opening at a position corresponding to that of each pad for exposing the pad;
- and
- an under bump metallurgy layer covering the dielectric layer, the pads and the passivation layers to connect the pads.
A process for producing a connectable under bump structure, which comprises the steps of:
- (a) providing a wafer, and providing a plurality of pads on a wafer surface of the wafer and a plurality of passivation layers covering the wafer surface around the pads, wherein each passivation layer has a first opening at the position corresponding to each pad for exposing the pad;
- (b) forming a dielectric layer on the wafer surface between the pads and the two adjacent passivation layers in step (a) and on the passivation layers;
- (c) etching the dielectric layer formed in step (b) at positions corresponding to those of the first openings to expose the pads;
- and
- (d) forming an under bump metallurgy layer on the pads, the passivation layers and the dielectric layer for connecting the pads exposed by the first openings.
Dependencies are inferred from the claim text.