Encapsulated high-frequency electrical circuit
AssigneeHEI, Inc.
InventorsSimon Leung, Guanghua Huang
Life of this patent
Estimating the term…
Abstract
An apparatus for processing a high-frequency electrical signal. The apparatus comprises a circuit carrier and an electrical circuit mounted on the circuit carrier. The electrical circuit processes a signal within a predetermined frequency range, the predetermined fundamental frequency range having a low end in the range being about 1 GHz or higher. An encapsulent material encapsulates at least a portion of the electrical circuit. The circuit carrier, electrical circuit, and encapsulent material form a package having resonant frequencies. The resonant frequencies are outside the predetermined frequency range.
Claims29
An apparatus for processing a high-frequency electrical signal, the apparatus comprising:
- an electrical circuit arranged to process a signal having a fundamental frequency of about 1 GHz or higher;
- and
- an encapsulent material encapsulating at least a portion of the electrical circuit.
An apparatus for processing a high-frequency electrical signal, the apparatus comprising:
- a circuit carrier;
- an electrical circuit mounted on the circuit carrier, the electrical circuit processing a signal within a predetermined frequency range, the predetermined frequency range having a low end, the low end of the of the predetermined frequency range being about 20 GHz or higher;
- an encapsulent material encapsulating at least a portion of the electrical circuit;
- and
- wherein the circuit carrier, electrical circuit, and encapsulent material form a package, the package having resonant frequencies, the resonant frequencies being outside the predetermined frequency range.
A method of manufacturing an apparatus for processing a high-frequency electrical signal, the method comprising:
- providing a circuit carrier, a plurality of circuits being mounted on the circuit carrier;
- encapsulating at least a portion of each of the circuits;
- and
- separating the circuit carrier into two or more individual boards so that each board has at least one circuit and the encapsulent is around at least a portion of the at least one circuit on each board.
Dependencies are inferred from the claim text.