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US 2003/0141588 A1Published application
Semiconductor device
AssigneeKabushiki Kaisha Toshiba
InventorsTsunehiro Sato, Kiyotaka Hayashi
Life of this patent
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Abstract
A semiconductor device includes at least three circuit substrates laid one upon another. The device further includes first circuit elements mounted, respectively, on at least two of the three circuit substrates. It also includes a second circuit element mounted on one of the three circuit substrates and configured to change connection between the first circuit elements.
Claims20
A semiconductor device comprising:
- at least three circuit substrates laid one upon another;
- first circuit elements mounted, respectively, on at least two of said at least three circuit substrates;
- and
- a second circuit element mounted on one of said at least three circuit substrates and configured to change connection between the first circuit elements.
1 more element
A semiconductor device comprising:
- a first circuit substrate;
- a first circuit element which is mounted on the first circuit substrate to receive an input signal from an external device;
- a second circuit substrate provided on the first circuit substrate;
- a second circuit element which is mounted on the second circuit substrate, connected to the first circuit element and different in type from the first circuit element;
- a third circuit substrate provided on the second circuit substrate;
- and
- a changeover circuit which is mounted on the third circuit substrate and changes the connection of the second circuit element and the first circuit element to the connection of the second circuit element and an external device,
- wherein, in a first mode, a signal output from the first circuit element is input to the second circuit element, and in a second mode, a signal output from the external device is input to the second circuit element.
5 more elements
A semiconductor device comprising:
- a first circuit substrate;
- a first circuit element which is mounted on the first circuit substrate to receive an input signal from an external device;
- a second circuit substrate provided on the first circuit substrate;
- a second circuit element which is mounted on the second circuit substrate to receive an input signal from the external device;
- a third circuit substrate provided on the second circuit substrate;
- a third circuit element which is mounted on the third circuit substrate to receive an input signal from the external device;
- a fourth circuit substrate provided on the third circuit substrate;
- and
- a changeover circuit which is mounted on the fourth circuit substrate, connects the first, second and third circuit elements, and changes the connection of the first, second and third circuit elements and the connection of the first, second and third circuit elements to the external device,
- wherein at least one of the first, second and third circuit elements is different in type from the other circuit elements.
7 more elements
Dependencies are inferred from the claim text.