Lead frame for resin-molded semiconductor device
AssigneeFuji Electric Co., Ltd.
InventorsYoshinori Oda, Atsushi Maruyama
Life of this patent
Estimating the term…
Abstract
A lead frame for a resin-molded semiconductor device is provided with die pads for separately mounting chips of power elements and a control IC thereon; terminal leads arranged in a row at one side and including leads for the die pads, and a main circuit, a control power supply and signal circuit separated from the die pads; and a dam bar connecting the terminal leads. In the main circuit terminals and control power supply terminals, a plurality of leads is formed and drawn in advance. After the lead frame is set in a mold die and is resin-molded, certain leads that are not used as the terminal leads are selected among the plurality of the leads, and the certain leads are cut and removed together with the dam bar.
Claims6
A lead frame for a semiconductor device sealed with a resin, comprising:
- die pads for mounting chips,
- first leads connected to the die pads, second leads to be connected to the chips, and at least one spare lead, said first, second and at least one spare leads being disposed parallel to each other at one side of the lead frame, and
- a dam bar laterally connecting all the leads, said dam bar being located so that said dam bar and at least one of the leads not used for the semiconductor device are removed from the lead frame after the chips are mounted on the die pads and connected to the second leads, and a circuit portion thereof is sealed with the resin.
Dependencies are inferred from the claim text.