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US 2003/0141576 A1Published application
Semiconductor chip mounting substrate and flat display
AssigneeFujitsu Hitachi Plasma Display Limited
InventorsToyoshi Kawada, Yuji Sano
Life of this patent
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Abstract
A semiconductor chip mounting substrate having a semiconductor bare chip and a substrate electrically connected to the semiconductor bare chip by wire bonding is provided. Here, a protective film is provided on the surface of the semiconductor bare chip and is disposed so as to expose all or a part of a bonding wire.
Claims14
A semiconductor chip mounting substrate, comprising:
- a semiconductor bare chip;
- a substrate electrically connected to said semiconductor bare chip by wire bonding;
- and
- a first protective film provided on a surface of said semiconductor bare chip and disposed so as to expose all or a part of a bonding wire.
1 more element
A flat display, comprising:
- a flat display panel;
- and
- a semiconductor chip mounting substrate connected to said flat display panel,
- wherein said semiconductor chip mounting substrate comprises a semiconductor bare chip, a substrate electrically connected to said semiconductor bare chip by wire bonding, and a first protective film provided on a surface of said semiconductor bare chip and disposed so as to expose all or a part of a bonding wire.
1 more element
Dependencies are inferred from the claim text.