Method for producing a micromechanical component, and a component produced according to said method

A method for manufacturing a micromechanical component (100), which has at least one hollow space (22) and one functional element (12) that is provided at least partially in the hollow space (22) and/or one functional layer (13a, 13b, 13c) that is provided at least partially therein, the functional element (12) and/or the functional layer (13a, 13b, 13c) being provided with a first protective layer (41;

• 71) at least in an area that directly or indirectly borders on a first sacrificial layer (52), which temporarily occupies at least partially the space of the hollow space (22) that is subsequently formed in one or a plurality of etching steps (FIG. 4;
• FIG. 7), the material of the first protective layer (41;
• 71) being selected such that at least one etching process and/or etching medium, which etches or dissolves the first sacrificial layer (52), either does not substantially attack the first protective layer (41;
• 71) or does so only at a reduced etching rate in comparison to the first sacrificial layer (52), on the side of the second protective layer (71) facing away from the first sacrificial layer (52), a cap layer (20;
• 82) being provided that at least partially surrounds the hollow space (22), and for the functional element (12) and/or for the functional layer (13a, 13b, 13c) and for the first sacrificial layer (52) and/or for the second sacrificial layer (31), at least partially the same material being selected, such as, specifically, silicon, which is preferably polycrystalline.