Electron source plate, image-forming apparatus using the same, and fabricating method thereof
AssigneeCanon Kabushiki Kaisha
InventorsYasuyuki Watanabe, Kazuya Ishiwata, Shinsaku Kubo
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Abstract
A covering layer for insulating between column wirings and device electrodes is formed in a region including each cross point of the column wirings and row wirings and under the column wirings. Thus, when an electron source plate in which a large number of electron-emitting devices are wired in passive matrix is formed, a defect resulting from an interaction between the device electrodes and the column wirings at the time of wiring formation is reduced to improve insulation reliability. Therefore, a high quality image is obtained by a large size and higher density pixel arrangement in an image-forming apparatus using the electron source plate.
Claims14
An electron source plate comprising:
- a substrate, wirings arranged in a matrix of column wirings and row wirings on the substrate, an insulating layer being interposed between column and row wirings at each cross point of column and row wirings, and electron emitting devices each of which is provided with a pair of device electrodes arranged in the vicinity of each cross point of column and row wirings,
- wherein a covering layer covers a portion of one of the pair of device electrodes, said portion is neighboring to the cross point of column and row wirings, one of column and row wirings which is electrically connected to said one of the pair of device electrodes overlies said covering layer and said covering layer comprises a material different from those of said one of column and row wirings and said one of the pair of device electrodes.
A method of fabricating an electron source plate comprising:
- a substrate, wirings arranged in a matrix of column wirings and row wirings on the substrate, an insulating layer being interposed between column and row wirings at each cross point of column and row wirings, and electron emitting devices each of which is provided with a pair of device electrodes arranged in the vicinity of each cross point of column and row wirings, the method comprising:
- forming the pair of device electrodes on the substrate,
- forming a covering layer to cover a portion of one of the pair of device electrodes, the portion being neighboring to a position which is to be the cross point of column and row wirings,
- forming one of column and row wirings which is to be connected to said one of the pair of device electrodes with overlying the covering layer
- forming the insulating layer to insulate said one of column and row wirings at an region which is to be the cross point of column and row wirings;
- and
- forming the other of column and row wirings with overlying the insulating layer at the cross point of column and row wirings,
- wherein said covering layer comprises a material different from those of said one of column and row wrings and said one of the pair of device electrodes.
Dependencies are inferred from the claim text.