US 2003/0141517 A1 · Compression assembled electronic package having a plastic molded insulation ring

Abstract

A compression assembled semiconductor package for housing a power semiconductor die which includes two major pole pieces in intimate electrical contact with respective major electrodes of a power semiconductor die. The package includes a plastic molded insulation ring disposed around the power semiconductor die. The pole pieces are secured to respective ends of the plastic molded insulation ring. One of the pole pieces may include an annular flange that penetrates the plastic molded insulation ring from an interior wall thereof and is embedded in its body. An annular flange may also be embedded in the plastic molded insulation ring and connected to an annular rib of a pole piece by a circular connector.

Claims25

Dependent claims

A compression assembled semiconductor package comprising:

a semiconductor die having a first major surface and a second major surface;
a control electrode disposed on a first major surface of said semiconductor die, and first and second electrodes disposed on first and second major surfaces respectively of said semiconductor die;
a molded plastic insulation ring annularly disposed around said semiconductor die;
a control signal carrier extending through said molded insulation ring from the exterior thereof and electrically connected to said control electrode;
a first pole being in surface-to-surface electrical contact with said first electrode;
and
a second pole being in surface-to-surface electrical contact with said second electrode, whereby said semiconductor die is held in place between said first pole and said second pole.

4 more elements

Dependencies are inferred from the claim text.

Compression assembled electronic package having a plastic molded insulation ring

Life of this patent

Compression assembled electronic package having a plastic molded insulation ring

Life of this patent

Abstract

Claims25