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US 2003/0141512 A1Published application
Semiconductor component and method for fabricating a semiconductor component
OwnerGeorg Bruderl, Johannes Baurinventors
Life of this patent
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Abstract
A semiconductor component has a substrate and a semiconductor body that contains at least one nitride compound semiconductor and is arranged on a surface of the substrate. An electrically conductive masking layer with a predetermined mask structure is arranged between the substrate and the semiconductor body. The masking layer partly covers the surface of the substrate. Furthermore, the invention describes a method for fabricating such a semiconductor component.
Claims27
A semiconductor component, comprising:
- an electrically conductive substrate having a surface;
- a semiconductor body disposed on said surface of said substrate and containing at least one nitride compound semiconductor;
- an electrically conductive masking layer between said substrate and said semiconductor body, said masking layer having a predetermined mask structure for reducing an electrical series resistance of said semiconductor component, and said mask structure partly covering said surface of said substrate.
A method of fabricating a semiconductor component, which comprises:
- providing a substrate with a surface;
- applying an electrically conductive masking layer to the substrate surface and forming a predetermined mask structure, to partly cover the substrate surface by the masking layer;
- applying at least one semiconductor layer of a semiconductor body on the substrate and on the masking layer, the semiconductor body containing at least one nitride compound semiconductor.
Dependencies are inferred from the claim text.