Radiation emitting semiconductor component with luminescent conversion element
AssigneeOSRAM Opto Semiconductors GmbH
InventorsHerbert Brunner, Alexandra Debray, Harald Jager, Gunther Waitl
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Abstract
The invention describes a radiation-emitting semiconductor component with a luminescent conversion element, at which the semiconductor body is placed in a recess of the base body. A cup-like area is molded inside of the recess around the semiconductor body, which contains the luminescent conversion element and coats the semiconductor body. The cup-like portion is formed as indentation inside of the recess or as annular border on the base of the recess.
Claims25
A radiation emitting semiconductor component comprising:
- a base body defining an open interior recess, the recess further comprising walls defining a cup like molded portion wherein at least one semiconductor body and a luminescent conversion element are accommodated such that said luminescent conversion element defines a boundary surface between said cup like molded portion and a remainder of the open interior recess.
A method for producing a radiation emitting semiconductor component with a:
- luminescent conversion element, comprising the steps of:
- forming a base body having a open interior recess and an imbedded conductor frame,
- coating the conductor frame with a compound,
- forming a chip service area on the conductor frame and recessing the area,
- forming a cup like portion on the area, the cup like portion defining an internal recess,
- installing a semiconductor body on the area and bonding the semiconductor body,
- filling the cup like portion with a luminescent conversion element such that a boundary surface of the luminescent conversion element separates the cup like portion internal recess from the open interior recess.
A method for the production of a radiation emitting semiconductor component with a luminescent conversion element, further comprising the steps of:
- forming a base body having an open internal region and an imbedded conductor frame, the frame further comprising a chip service area,
- molding an annular border around the chip service area, the border defining a cup-like portion having an interior area,
- installing a semiconductor body on the chip service area and bonding the semiconductor body, and
- filling the interior area with a luminescent conversion element.
Dependencies are inferred from the claim text.