# US 2003/0141314 A1 · Chemical treating apparatus > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2003/0141314 A1 - Document ID: US20030141314A1 - Status: Published application - Kind: A1 - Application number: 10/353,151 - Filed: 2003-01-28 - Published: 2003-07-31 - Earliest claimed: 2002-01-31 - Assignees: Dainippon Screen Mfg. Co., Ltd. - Inventors: Shigehiro Goto; Katsushi Yoshioka; Minobu Matsunaga - Web page: https://patentgrep.com/patent/US20030141314A1 ## CPC - H10P 72/0448: {Apparatus for applying a liquid, a resin, an ink or the like} - B05B 7/1666: {fixed to the discharge device} - B05C 5/001: {incorporating means for heating or cooling the liquid or other fluent material (B05C11/1042 takes precedence)} - G03F 7/162: {Coating on a rotating support, e.g. using a whirler or a spinner} - H10P 72/0414: {using mainly spraying means, e.g. nozzles} - B05B 12/1472: {separate supply lines supplying different materials to separate outlets of the spraying apparatus (B05B12/1454 takes precedence)} - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 - B05B: SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES (spray-mixers with nozzles B01F25/72; processes for applying liquids or other fluent materials to surfaces by spraying B05D) - B05C: APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL (spraying apparatus, atomising apparatus, nozzles B05B; plant for applying liquids or other fluent materials to objects by electrostatic spraying B05B5/08) - G03F: PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR; (phototypographic composing devices B41B; photosensitive materials or processes for photographic purposes G03C; electrophotography, sensitive layers or processes therefor G03G) ## Abstract A chemical treating apparatus for performing a predetermined treatment of a principal surface of a substrate by delivering a treating solution thereto. The apparatus includes a treating solution delivery nozzle for delivering the treating solution to the principal surface of a substrate. The nozzle has a treating solution reservoir adjacent a tip end thereof for storing the treating solution. A temperature control device holds the treating solution reservoir to control the temperature of the treating solution in the treating solution reservoir through heat exchange with the treating solution. ## Claims ### Claim 1 A chemical treating apparatus for performing a predetermined treatment of a principal surface of a substrate by delivering a treating solution thereto, said apparatus comprising: a treating solution delivery nozzle for delivering the treating solution to the principal surface of the substrate, said nozzle including a treating solution reservoir adjacent a tip end thereof for storing the treating solution; and temperature control means for holding said treating solution reservoir to control temperature of the treating solution in said treating solution reservoir through heat exchange with the treating solution. ### Claim 2 (depends on 1) An apparatus as defined in claim 1, wherein said temperature control means comprises a temperature control container for receiving said treating solution delivery nozzle, and holding said treating solution reservoir to control temperature of the treating solution in said treating solution reservoir through heat exchange with the treating solution. ### Claim 3 (depends on 1) An apparatus as defined in claim 1, wherein said temperature control means comprises nozzle temperature controlling and moving means for holding said treating solution reservoir to control temperature of the treating solution in said treating solution reservoir through heat exchange with the treating solution, and for moving said treating solution delivery nozzle to a predetermined position over the principal surface of the substrate while holding said treating solution reservoir. ### Claim 4 (depends on 2) An apparatus as defined in claim 2, further comprising: nozzle moving means for moving said treating solution delivery nozzle to a predetermined position over the principal surface of the substrate; wherein said treating solution delivery nozzle has an engageable portion disposed in a position other than heat exchange portions of said treating solution reservoir held by said temperature control container, a heat insulating member being provided between the heat exchange portions and the engageable portion or on the engageable portion. ### Claim 5 (depends on 2) An apparatus as defined in claim 2, further comprising: nozzle moving means having a holder for gripping said treating solution reservoir, said nozzle moving means moving said treating solution delivery nozzle to a predetermined position over the principal surface of the substrate, with said holder gripping said treating solution reservoir; and a holder temperature control container provided separately from said temperature control container for receiving said holder and controlling temperature of said holder. ### Claim 6 (depends on 1) An apparatus as defined in claim 1, wherein said treating solution reservoir is shaped to have a large surface area per volume. ### Claim 7 (depends on 1) An apparatus as defined in claim 1, wherein said treating solution reservoir is sized to store the treating solution in a quantity to be used in a next delivery cycle. ### Claim 8 (depends on 2) An apparatus as defined in claim 2, wherein said treating solution reservoir is sized to store the treating solution in a quantity to be used in a next delivery cycle. ### Claim 9 (depends on 1) An apparatus as defined in claim 1, wherein said treating solution reservoir comprises a channel for directing the treating solution to a lower position, then to an upper position higher than the lower position, and again downward to be delivered from a discharge opening. ### Claim 10 (depends on 2) An apparatus as defined in claim 2, wherein said treating solution reservoir comprises a channel for directing the treating solution to a lower position, then to an upper position higher than the lower position, and again downward to be delivered from a discharge opening. ### Claim 11 A chemical treating apparatus for performing a predetermined treatment of a principal surface of a substrate by delivering a treating solution thereto, said apparatus comprising: a treating solution delivery nozzle including a treating solution reservoir adjacent a tip end thereof for storing the treating solution; and temperature control means for contacting or approaching at least a major part of one of surfaces defining said treating solution reservoir to control temperature of the treating solution in said treating solution reservoir through heat exchange with the treating solution. ### Claim 12 (depends on 11) An apparatus as defined in claim 11, wherein said temperature control means comprises a temperature control container for receiving said treating solution delivery nozzle to control temperature of the treating solution in said treating solution reservoir. ### Claim 13 (depends on 11) An apparatus as defined in claim 11, wherein said temperature control means comprises nozzle temperature controlling and moving means for moving said treating solution delivery nozzle to a predetermined position over the principal surface of the substrate while holding said treating solution reservoir. ### Claim 14 (depends on 11) An apparatus as defined in claim 11, wherein said nozzle temperature controlling and moving means is arranged to hold said treating solution reservoir by vacuum suction. ### Claim 15 (depends on 11) An apparatus as defined in claim 11, wherein said nozzle temperature controlling and moving means is arranged to hold said treating solution reservoir by magnetism. ### Claim 16 (depends on 11) An apparatus as defined in claim 11, wherein said nozzle temperature controlling and moving means is arranged to hold said treating solution reservoir by scooping action. ### Claim 17 (depends on 11) An apparatus as defined in claim 11, wherein said nozzle temperature controlling and moving means is arranged to hold said treating solution reservoir by attracting said treating solution reservoir upward by magnetism. ### Claim 18 (depends on 11) An apparatus as defined in claim 11, wherein said treating solution reservoir has a shape of an inverted cone, said nozzle temperature controlling and moving means being arranged to hold said treating solution reservoir in an opening shaped to fit on the inverted cone. ### Claim 19 (depends on 11) An apparatus as defined in claim 11, wherein said nozzle temperature controlling and moving means includes two hinged parts for opening and closing relative to each other to hold said treating solution reservoir. ### Claim 20 (depends on 11) An apparatus as defined in claim 11, wherein a temperature-controlled portion of said treating solution reservoir or a temperature-controlling portion of said temperature control means has projections formed thereon.