Substrate and method of forming substrate for fluid ejection device
AssigneeHewlett-Packard Development Company, L.P.
InventorJeffery S. Hess
Life of this patent
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Abstract
A method of forming an opening through a substrate includes etching into the substrate from a first side so as to form a first portion of the opening, etching into the substrate from a second side opposite the first side so as to form a second portion of the opening, continuing etching into the substrate from at least one of the first side and the second side toward the other of the first side and the second side so as to communicate the first portion and the second portion of the opening, and etching into the substrate from an interface between the first portion and the second portion of the opening, including etching toward the second side of the substrate and forming a third portion of the opening.
Claims71
A method of forming an opening through a substrate, the method comprising:
- etching into the substrate from a first side, including forming a first portion of the opening;
- etching into the substrate from a second side opposite the first side, including forming a second portion of the opening;
- continuing etching into the substrate from at least one of the first side and the second side toward the other of the first side and the second side, including communicating the first portion and the second portion of the opening;
- and
- etching into the substrate from an interface between the first portion and the second portion of the opening, including etching toward the second side of the substrate and forming a third portion of the opening.
A method of forming a substrate for a fluid ejection device, the method comprising:
- etching a first portion of a fluidic channel into the substrate from a first side;
- etching a second portion of the fluidic channel into the substrate from a second side opposite the first side;
- continued etching of at least one of the first portion and the second portion of the fluidic channel to the other of the first portion and the second portion of the fluidic channel;
- and
- overetching the second portion of the fluidic channel from an interface between the first portion and the second portion of the fluidic channel, including etching toward the second side of the substrate.
A substrate for a fluid ejection device, the substrate comprising:
- a first side;
- a second side opposite the first side;
- and
- a fluidic channel communicating with the first side and the second side,
- wherein a first portion of the fluidic channel extends from the first side toward the second side, a second portion of the fluidic channel extends from the second side toward the first side, and a third portion of the fluidic channel extends from an interface between the first portion and the second portion of the fluidic channel toward the second side.
A substrate for a fluid ejection device, the substrate comprising:
- a first side;
- a second side opposite the first side;
- and
- a fluidic channel communicating with the first side and the second side, wherein a first portion of the fluidic channel converges from the first side toward the second side, a second portion of the fluidic channel converges from the second side toward the first side, and a third portion of the fluidic channel diverges from the second side toward the first side.
Dependencies are inferred from the claim text.