Method of fabricating a semiconductor memory device
AssigneeMacronix International Co., Ltd.
InventorsTsai-Fu Chang, Shih-Lin Chu, Ching-Pen Yeh
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AssigneeMacronix International Co., Ltd.
InventorsTsai-Fu Chang, Shih-Lin Chu, Ching-Pen Yeh
Estimating the term…
A method of fabricating a semiconductor memory device, particularly a mask ROM. A sacrificial oxide layer is formed on a silicon substrate and then a photoresist layer is formed on the sacrificial oxide layer. The photoresist layer is patterned to form a plurality of openings where bit lines are to extend respectively. Taking the patterned photoresist layer as a mask, arsenic ions are implanted into the silicon substrate through the openings and then boron ions are implanted into the silicon substrate through the openings. The implantation depth of boron ions are deeper than arsenic ions. The photoresist layer and the sacrificial oxide layer are removed after implantation. A gate oxide and a field oxide are grown simultaneously on the non-implanted and the implanted regions of the semiconductor layers respectively and a gate conductive layer is deposited on the silicon substrate.
A method of fabricating a semiconductor memory device, comprising:
A method of fabricating a mask ROM, comprising:
Dependencies are inferred from the claim text.