Contact assemblies, methods for making contact assemblies, and machines with contact assemblies for electrochemical processing of microelectronic workpieces

A contact assembly for use in an electrochemical deposition system to apply an electrical potential to a microelectronic workpiece, comprising:

• a support member having a ring including an inner wall defining an opening configured to receive the workpiece and a plurality of turrets depending downwardly;
• a plurality of dielectric sheaths coupled to the support member, wherein each sheath has a bore and projects from a corresponding turret inwardly into the opening;
• and
• a plurality of conductors having a first section, a second section, and an inert exterior on at least the second section, wherein at least the first section of each conductor is received in the bore of a sheath.

A reactor for electrochemical deposition processing of a microelectronic workpiece, comprising:

• a vessel configured to hold a processing solution;
• an electrode disposed relative to the vessel to provide an electrical potential in the vessel;
• a head assembly moveable relative to the vessel between a load/unload position and a processing position;
• and
• a contact assembly carried by the head assembly, wherein the contact assembly comprises
• a support member having an inner wall defining an opening configured to receive the workpiece;
• and
• a plurality of contacts including a conductor and a cover, the conductor comprising a proximal section projecting inwardly into the opening relative to the support member, a distal section extending from the proximal section, and an inert exterior at least at the distal section, and the cover comprising a dielectric element covering at least the proximal section of the conductor.

A reactor for electrochemical deposition processing of a microelectronic workpiece, comprising:

• a vessel configured to hold a processing solution;
• an electrode disposed relative to the vessel to provide an electrical potential in the vessel;
• a head assembly moveable relative to the vessel between a load/unload position and a processing position;
• and
• a contact assembly carried by the head assembly, wherein the contact assembly comprises
• a support member having an inner wall defining an opening configured to receive the workpiece and an electrically conductive element;
• and
• a contact system having a plurality of contacts projecting inwardly into the opening relative to the support member, the contacts including a conductor having a contact site with an inert surface and a dielectric cover over at least a portion of the conductor, and the conductor being electrically coupled to the conductive element of the support member.

A reactor for electrochemical deposition processing of a microelectronic workpiece, comprising:

• a vessel configured to hold a processing solution;
• an electrode disposed relative to the vessel to provide an electrical potential in the vessel;
• a head assembly moveable relative to the vessel between a load/unload position and a processing position;
• and
• a contact assembly carried by the head assembly, wherein the contact assembly comprises
• a ring having an inner wall defining an opening configured to receive the workpiece;
• and
• a plurality of contacts projecting inwardly from the ring into the opening, the contacts comprising a dielectric element and a conductor having a first section in the dielectric element and a second section exposed relative to the dielectric element, and wherein at least the second section of the conductor has an inert exterior.

A reactor for electrochemical deposition processing of a microelectronic workpiece, comprising:

• a vessel configured to hold a processing solution;
• an electrode disposed relative to the vessel to provide an electrical potential in the vessel;
• a head assembly moveable relative to the vessel between a load/unload position and a processing position;
• and
• a contact assembly carried by the head assembly, wherein the contact assembly comprises
• a support member having a ring including an inner wall defining an opening configured to receive the workpiece and a plurality of turrets depending downwardly;
• a plurality of dielectric sheaths coupled to the support member, wherein each sheath has a bore and projects from a corresponding turret inwardly into the opening;
• and
• a plurality of conductors having a first section, a second section, and an inert exterior on at least the second section, wherein at least the first section of each conductor is received in the bore of a sheath.

A tool for electrochemical processing of a microelectronic workpiece, comprising:

• a cabinet;
• a transfer mechanism;
• and
• an electroplating reactor in the cabinet comprising a vessel configured to hold a processing solution, an electrode disposed relative to the vessel to provide an electrical potential in the vessel, a head assembly moveable relative to the vessel between a load/unload position and a processing position, and a contact assembly carried by the head assembly, wherein the contact assembly comprises
• a support member having an inner wall defining an opening configured to receive the workpiece;
• and
• a plurality of contacts including a conductor and a cover, the conductor comprising a proximal section projecting inwardly into the opening relative to the support member, a distal section extending from the proximal -section, and an inert exterior at least at the distal section, and the cover comprising a dielectric material covering at least the proximal section of the conductor.

A tool for electrochemical processing of a microelectronic workpiece, comprising:

• a cabinet;
• a transfer mechanism;
• and
• an electroplating reactor in the cabinet comprising a vessel configured to hold a processing solution, an electrode disposed relative to the vessel to provide an electrical potential in the vessel, a head assembly moveable relative to the vessel between a load/unload position and a processing position, and a contact assembly carried by the head assembly, wherein the contact assembly comprises
• a support member having a ring including an inner wall defining an opening configured to receive the workpiece and a plurality of turrets depending downwardly;
• a plurality of dielectric sheaths coupled to the support member, wherein each sheath has a bore and projects from a corresponding turret inwardly into the opening;
• and
• a plurality of conductors having a first section, a second section, and an inert exterior on at least the second section, wherein at least the first section of each conductor is received in the bore of a sheath.