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US 2003/0141108 A1Published application
Single-sided circuit board and method for maufacturing the same
AssigneeIbiden Co., Ltd.
InventorsRyo Enomoto, Yasuji Hiramatsu
Life of this patent
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AssigneeIbiden Co., Ltd.
InventorsRyo Enomoto, Yasuji Hiramatsu
Estimating the term…
Holes (40a) are formed with a laser beam through an insulating substrate (40) on which a metallic layer (42) is formed and via holes (36a) are formed by filling up the holes (40a) with a metal (46). After the via holes (36a) are formed, a conductor circuit (32a) is formed by etching the metallic layer (42) and a single-sided circuit board (30A) is formed by forming projecting conductors (38a) on the surfaces of the via holes (36a). The projecting conductors (38a) on the circuit board (30A) are put on the conductor circuit (32b) of another single-sided circuit board (30B) with adhesive layers (50) composed of an uncured resin in-between and heated and pressed against the circuit (32b). The projecting conductors (38a) get in the uncured resin by pushing aside the resin and are electrically connected to the circuit (32b). Since single-sided circuit boards (30A, 30B, 30C, and 30D) can be inspected for defective parts before the boards (30A, 30B, 30C, and 30D) are laminated upon one another, only defectless single-sided circuit can be used in the step of lamination.
A single-sided circuit substrate comprising:
A method of manufacturing a single-sided circuit substrate at least comprising the steps (1) to (4):
A method of manufacturing a single-sided circuit substrate at least comprising the steps (1) to (3):
Dependencies are inferred from the claim text.