Circuit component built-in module, radio device having the same, and method for producing the same

A method for producing a circuit component built-in module, comprising:

• placing a circuit component on a first wiring pattern formed on one principal surface of a base material for connection therebetween and sealing at least a connection portion between the first wiring pattern and the circuit component with a second mixture comprising an inorganic filler and an uncured thermosetting resin;
• subsequently, allowing a first mixture comprising an inorganic filler and an uncured thermosetting resin to face the principal surface of the base material on which the circuit component is formed and pressing the base material to bury the circuit component in the first mixture;
• wherein the amount of the inorganic filler contained in the first mixture is larger than the amount of the inorganic filler contained in the second mixture.

50 The method for producing a circuit component built-in module according to of claim 35, wherein forming the second wiring pattern is performed after forming the inner via conductor, and comprises forming the second wiring pattern on one principal surface of a mold release carrier for the second wiring pattern, allowing the mold release carrier to face the principal surface on which the second wiring pattern is formed to the surface of the first mixture opposite to the surface on which the circuit component is formed and pressing the mold release carrier;

• heating at the temperature where the thermosetting resin of the first and second mixtures and the conductive substance of the inner via conductor are cured;
• and peeling the mold release carrier off.