US 2003/0141103 A1 · PCB solder pad geometry including patterns improving solder coverage

Abstract

An improved PCB bond pad (22, 40, 50, 60) having a dimensioned geometry that improves solder re-flow and facilitates outgassing of bubbles generated in solder during re-flow to reduce voiding. The improved PCB bond pad design is particularly useful to improve re-flow for RF devices that are sensitive to voiding in solder after re-flow and provides an excellent ground plane/heat sink connection. The present invention includes a printed circuit board (PCB) having a patterned bond pad defining solder channels (30, 42, 52, and 62). During re-flow, bubbles outgas through the channels from under a contact pad (34) of an overlying IC device thereby providing nearly 100 percent solder coverage at interface of device exposed pad and PCB bond pad.

Claims18

Dependent claims

A printed circuit board (PCB) comprising:

a first layer of non-conductive material;
and
a bond pad comprising a patterned conductive second material disposed upon said first layer said patterned bond pad defining a channel therein facilitating outgassing of bubbles via the channel.

Dependencies are inferred from the claim text.

Facts

Application

10/066,246Filed 31 Jan 2002

Published

31 Jul 2003

Term ends

Not estimatedThe source records don’t support an estimate.

Classification11 codes

H05K 3/341
By soldering: surface mounted components
H05K 1/111
Printed elements for providing electric connections to or between printed circuits: pads for surface mounting, e.g. lay-out
H05K 2201/09381
Pads and lands: shape of non-curved single flat metallic pad, land or exposed part thereof; Shape of electrode of leadless component
H05K 2201/10727
Components characterised by their electrical contacts: leadless chip carrier [LCC], e.g. chip-modules for cards

PCB solder pad geometry including patterns improving solder coverage

Life of this patent

PCB solder pad geometry including patterns improving solder coverage

Life of this patent

Abstract

Claims18