Metallic coated dielectric substrates
AssigneeHoneywell International Inc.
InventorRobert J. Saccomanno
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Abstract
A metal/dielectric construction comprises either an optically transmissive substrate adapted for channeling light therethrough, or a dielectric substrate, an optional adhesion-promoting layer comprising an oxide form of at least one metal or metalloid deposited onto the surface of the substrate, a layer composed of a highly reflective and/or electrically conductive/electromagnetic metal overlaying the adhesion-promoting layer, and a protective layer composed of a parylene polymer film formed over the metal layer.
Claims40
An optical construction comprising:
- an optically transmissive substrate;
- a reflective layer composed of a highly reflective metal overlaying the optically transmissive substrate, and bonded thereto;
- and
- a protective layer composed of a parylene polymer film bonded to the reflective metal layer
An optical construction comprising.
- an optically transmissive substrate;
- an adhesion-promoting layer comprising the oxide form of at least one metal or metalloid deposited onto the surface of the optically transmissive substrate;
- a reflective layer composed of a highly reflective metal;
- and
- a protective layer composed of a parylene polymer film in bonded contact with the reflective metal layer
An EMI shield construction for a device, comprising:
- an electrically conductive layer, surrounding said device;
- and
- a protective layer composed of a parylene polymer bonded to said electrically conductive layer.
An EMI shielded electrical cable including a centrally located electrical conductor comprising:
- an electrically insulating layer formed around the electrical conductor;
- an electrically conductive layer deposited on said electrically insulating layer;
- and
- a protective layer composed of a parylene polymer film deposited on said electrically conductive layer.
A method for making an EMI shield construction for a device, comprising the steps of:
- extending an electrically conductive layer at least substantially around said device for EMI shielding;
- and
- depositing a protective layer comprising a parylene polymer directly onto the electrically conductive layer of said EMI shield.
Dependencies are inferred from the claim text.