Green sheet and manufacturing method thereof, manufacturing method of multi-layer wiring board, and manufacturing method of double-sided wiring board

A manufacturing method for a multi-layer wiring board comprising the steps of:

• manufacturing a green sheet including a binder containing an acrylic resin having no polar group and a ceramics material in powder;
• forming an interlayer connecting via through the green sheet in a width direction thereof;
• after having placed a conductor layer having virtually no voids on the green sheet and then a mask on the conductor layer, patterning the conductor layer by wet-etching;
• laminating a plurality of the green sheets;
• after having placed on either both sides or one side of the green sheet multi-layered body thus manufactured a binding sheet containing an inorganic composition that has virtually no sintering shrinkage at the firing temperature of the green sheet multi-layered body as a main component, allowing the resulting multi-layered body to undergo a firing process and then removing the binding sheet therefrom.

A manufacturing method for a double-sided wiring board comprising the steps of:

• manufacturing a green sheet including the binder containing the acrylic resin having no polar group and the ceramics material in powder;
• forming interlayer connecting via through the green sheet in the width direction;
• after having placed a conductor layer having virtually no voids on the green sheet and then a mask on the conductor layer, patterning the conductor layer by wet-etching;
• and
• after having placed on either both sides or one side of the green sheet a binding sheet containing an inorganic composition that has virtually no sintering shrinkage at the firing temperature of the green sheet as a main component, allowing the resulting green sheet to undergo a firing process and then removing the binding sheet therefrom.