System and method for aligning an integrated circuit die on an integrated circuit substrate

A method for aligning an integrated circuit die on an integrated circuit substrate, the method comprising the steps of:

• placing a plurality of deposits of deformable material on said integrated circuit substrate where said integrated circuit die is to be attached to said integrated circuit substrate;
• placing a stamping tool into at least one tooling hole within said integrated circuit substrate;
• imprinting said plurality of deposits of deformable material with said stamping tool;
• and
• placing said integrated circuit die into a pocket formed in said plurality of deposits of deformable material.

A method for aligning an integrated circuit die on an integrated circuit substrate of the type comprising a first tooling hole and a second tooling hole, the method comprising the steps of:

• placing a plurality of deposits of deformable material on said integrated circuit substrate where said integrated circuit die is to be attached to said integrated circuit substrate;
• placing said integrated circuit substrate on a stamping tool base of a stamping tool;
• imprinting said plurality of deposits of deformable material with a stamp of said stamping tool;
• removing said integrated circuit substrate from said stamping tool base of said stamping tool;
• and
• placing said integrated circuit die into a pocket formed in said plurality of deposits of deformable material created by imprinting said plurality of deposits of deformable material with said stamp of said stamping tool.