Slotted substrates and methods and systems for forming same
AssigneeHewlett-Packard Development Company, L.P.
InventorsRio T. Rivas, Shen Buswell, Mehrgan Khavari, Jeffrey R. Pollard
Life of this patent
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Abstract
Methods and systems for forming slots in a substrate that has opposing first and second surfaces. The method makes a laser cut through either the first or second surface of the substrate sufficient to form a first trench. Material is also removed through the other of the first and second surfaces effective to form, in combination with the laser cut, a slot. At least a portion of the slot passes entirely through the substrate, and the slot has an aspect ratio greater than or equal to 1.
Claims52
A method of forming fluid handling slots in a semiconductor substrate having a thickness defined by a thin film side and a backside comprising:
- laser machining into the semiconductor substrate from the thin film side to form a first trench;
- and,
- removing semiconductor substrate material from the backside to form a second trench, wherein at least a portion of the first and second trenches intersect to form a slot through the semiconductor substrate.
A method of forming a fluid handling slot in a semiconductor substrate having a thickness between first and second opposing surfaces and microelectronics integrated thereon, comprising:
- creating, with a laser machining process, a first trench in the semiconductor substrate within one of the first and second surfaces;
- and,
- forming a second trench in the semiconductor substrate within the other of the first and second surfaces, wherein at least portions of the first and second trenches join together to form a slot, wherein the maximum width of the slot is about 50 percent or less of the thickness of the substrate.
A method of forming slots in a semiconductor substrate containing microelectronics, the semiconductor substrate having a thickness between a thin film side and a backside, the method comprising:
- laser machining through the thin film side at least about 40 percent of the thickness of the semiconductor substrate;
- and,
- removing material from the backside of the semiconductor substrate to form in combination with said laser machining, a slot through the thickness of the semiconductor substrate.
A method of forming slots in a substrate having opposing first and second surfaces comprising:
- making a laser cut through either the first or second surface of the substrate sufficient to form a first trench;
- and,
- removing material through the other of the first and second surfaces of the substrate effective to form, in combination with said laser cut, a slot at least a portion of which passes entirely through the substrate, and wherein said slot has an aspect ratio greater than or equal to 1.
A method of forming slots in a semiconductor substrate having a thickness defined by a thin film surface and an opposing backside surface comprising:
- laser machining a first trench through the thin film surface of the semiconductor substrate;
- forming a second trench through the backside surface of the semiconductor substrate effective to form, in combination with said first trench, a slot at least a portion of which passes entirely through the semiconductor substrate;
- and,
- wherein said laser machining forms a trench having a minimum depth of at least about 1 percent the thickness of the substrate and a maximum depth of about 50 percent the thickness of the substrate.
A method of forming slots in a semiconductor substrate comprising:
- removing material from a first side of the semiconductor substrate to form a first trench in the semiconductor substrate;
- laser machining a second trench in a second side of the semiconductor substrate wherein the second trench has a region that is deeper than other regions of the trench;
- and,
- wherein at least the deeper region of the second trench intersects the first trench to form a slot.
A method of forming a slot in a substrate comprising:
- laser machining an asymmetrical trench through a first surface of the substrate;
- and
- removing material through an opposite second surface of the substrate wherein said removing intercepts at least portions of the trench to form a slot through the substrate.
One or more computer-readable media having computer readable instructions thereon which, when executed by a computer, cause the computer to:
- cause material to be removed through either the first or second surfaces of a semiconductor substrate;
- and,
- cause a laser beam to cut through the other of the first or second surfaces of a semiconductor substrate effective to form in combination with said removed material, a slot to be formed, at least a portion of which passes entirely through the substrate.
A method of forming a fluid handling slot in a semiconductor substrate having a thickness between first and second opposing surfaces and microelectronics integrated thereon, comprising:
- laser machining a first trench in the semiconductor substrate through a first surface;
- and,
- sand drilling a second trench in the semiconductor substrate through the second surface, wherein at least portions of the first and second trenches join together to form a slot having an aspect ratio of at least one.
Dependencies are inferred from the claim text.