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US 2003/0140488 A1Published application
Enhanced design and process for a conductive adhesive
AssigneeInternational Business Machines Corporation
InventorsDonald Seton Farquhar, Gerard Paul Kohut, Andrew Michael Seman, Michael Joseph Klodowski
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Abstract
The present invention provides a new device and method for enhancing the electrical properties of the thick metal backer/electrically conductive thermoset adhesive/printed circuit board or card assembly. The enhanced electrical properties are obtained by providing a thin bondline of conductive adhesive that is essentially void free.
Claims13
1) An electrical device comprising:
- a metal substrate;
- a layer of electrically conductive thermoset adhesive bonded to said metal substrate;
- and
- a component bonded to said adhesive to form an essentially void free and thin bondline relative to a surface topography.
1 more element
6) A method for manufacturing an electrical component comprising:
- applying an electrically conductive thermoset adhesive onto a metal substrate;
- partially curing said adhesive;
- attaching a circuit board to said adhesive to form a substrate/adhesive/circuit board assembly;
- and
- laminating said assembly in a lamination press to form an electrical component.
2 more elements
10) An electrical device comprising:
- a first component;
- a layer of electrically conductive thermoset adhesive bonded to a bonding surface to said first component;
- and
- a second component bonded to said adhesive to form an essentially void free and thin bondline.
1 more element
Dependencies are inferred from the claim text.