Method of separating and handling a thin semiconductor die on a wafer

A method of separating a thin die from a support body of a semiconductor wafer, the thin die attached to the support body by a plurality of tethers that extend across an open trench in the wafer, the method comprising the steps of:

• positioning a tip of a handler above the thin die, the tip having a passageway to a vacuum source;
• activating the vacuum source to provide a suction force through the passageway of the tip;
• positioning an ejection pin in a spaced apart relationship beneath the thin die;
• moving the tip of the handler downward toward the thin die to break the plurality of tethers;
• and
• clamping the thin die between the tip of the handler and the ejection pin.

A method of separating a thin die from a support body of a semiconductor wafer, the thin die having an outer perimeter defined by an open trench in the wafer, the open trench positioned between the thin die and the support body of the wafer, the thin die attached to the support body by a plurality of tethers that extend across the open trench, the method comprising the steps of:

• positioning the wafer on a rigid backing having a hole, the hole positioned beneath the thin die;
• positioning an ejection pin within the hole of the backing and beneath the thin die;
• positioning a tip of a handler above the thin die, the tip having a passageway to a vacuum source;
• activating the vacuum source to provide a suction force through the passageway of the tip;
• moving the tip of the handler downward toward the thin die to break the plurality of tethers;
• and
• moving the thin die so that the thin die is positioned between the tip of the handler and the ejection pin.