Semiconductor chip carrying adhesive tape/sheet, semiconductor chip carrier, semiconductor chip mounting method and semiconductor chip packaging body
AssigneeLintec Corporation
InventorsOsamu Yamazaki, Kazuyoshi Gbe
Life of this patent
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Abstract
A semiconductor chip carrying adhesive tape, wherein a plurality of adhesive agent portions for adhering semiconductor chips 2 are intermittently formed on a tape shaped base material 11 in the longitudinal direction of the base material 11 to have a substantially identical shape with that of the semiconductor chip 2 to be adhered or a slightly larger shape than that, and an adhesive agent constituting said adhesive agent portions 12 has gradable adhesiveness, can improve a yield of adhesive agent attached semiconductor chips 2 and prevent a wasteful use of an adhesive agent.
Claims10
A semiconductor chip carrying adhesive tape, wherein a plurality of adhesive agent portions for adhering a semiconductor chip are intermittently formed on a tape shaped base material in a longitudinal direction of said base material, in a substantially identical shape with that of the semiconductor chip to be adhered or a slightly larger shape than that of the semiconductor chip to be adhered, and an adhesive agent constituting said adhesive agent portions has gradable adhesiveness.
A semiconductor chip carrying adhesive sheet, wherein a plurality of adhesive agent portions for adhering semiconductor chips are formed on a sheet shaped base material, in a substantially identical shape with that of the semiconductor chips to be adhered or a slightly larger shape than the semiconductor chips to be adhered, and an adhesive agent constituting said adhesive agent portions has gradable adhesiveness.
Dependencies are inferred from the claim text.