Substrate alignment method and apparatus

An apparatus for lifting substrates in a semiconductor packaging process, the apparatus comprising:

• a plate with a plurality of protrusions;
• a substrate tray with a plurality of depressions and a hole in each depression coupled to the plate, the substrate tray to hold a substrate in each depression;
• a lifting device with a plurality of vacuum pads coupled to the substrate tray, the lifting device to attach to the substrates and lift the substrates out of the substrate tray;
• a first actuator coupled to the plate, the first actuator to raise and lower the plate;
• and
• a second actuator coupled to the flipping device, the second actuator to lower and raise the lifting device.

A system for applying solder bumps to substrates in a flip chip packaging process, the system comprising:

• a loader station to load substrates into a substrate tray;
• a flipping station coupled to the loader station, the flipping station to flip substrates held in the substrate tray, the flipping station comprising:
• a plate with a plurality of protrusions;
• a flipping device with a plurality of vacuum pads coupled to the substrate tray, the flipping device to attach to the substrates, lift the substrates out of the substrate tray, and flip the substrates;
• a first actuator coupled to the plate, the first actuator to raise and lower the plate;
• a second actuator coupled to the flipping device, the second actuator to lower and raise the flipping device;
• a solder bump application station coupled to the flipping station, the solder bump application station to apply and bond solder bumps to the substrates;
• and
• wherein the first actuator raises the plate into the bottom of the substrate tray, the second actuator lowers the flipping device into the substrate tray when the substrate tray is in the flipping station.