US 2003/0140475 A1 · Multi-package conversion kit for a pick and place handler

Abstract

The present invention provides a kit and method for package-to-package conversion of a pick and place handler. An input arm assembly is provided with interchangeable vacuum leads such that package-to-package conversion only requires replacing the vacuum lead with a different size vacuum lead. An input/output shuttle plate is provided comprising a block and base plate. The block has a plurality of pocket groupings and a two or more alignment hole groupings. The base plate has two or more alignment pins. Package-to-package conversion is achieved by changing which alignment hole in each alignment hole grouping is set on the alignment pins, thereby selecting the pocket in each pocket grouping corresponding to the alignment hole used. A soak plate is provided having an array of pocket groupings, wherein each pocket grouping has the same pattern of different size/shape pockets to accommodate different packages. Package-to-package conversion is accomplished by programming an offset to the desired pocket in each pocket grouping. An test arm assembly is provided with interchangeable vacuum leads and interchangeable nest pieces such that package-to-package conversion only requires replacing the vacuum lead and nest piece with a different size vacuum lead and nest piece.

Claims10

Dependent claims

An input arm assembly for a pick and place handler, comprising:

(a) an input arm body having a pressure fitting, a through hole opposite said pressure fitting, and clips for attaching said input arm body to a base unit for a pick and place handler;
and
(b) a set of interchangeable vacuum leads having different sizes;
each vacuum lead of said set of interchangeable vacuum leads having a hollow upper cylindrical portion, a hollow lower cylindrical portion, and a flange therebetween;
wherein a vacuum lead with the desired size for a semiconductor device to be picked and placed is chosen from said set of interchangeable vacuum leads, inserted into said through hole of said input arm body, and retained by said pressure fitting.

2 more elements

A kit for package-to-package conversion of a pick and place handler, comprising:

(a) an input arm assembly for a pick and place handler, comprising a set of interchangeable vacuum leads having different sizes;
each vacuum lead of said set of interchangeable vacuum leads having a hollow upper cylindrical portion, a hollow lower cylindrical portion, and a flange therebetween;
wherein a vacuum lead with the desired size for a semiconductor device to be picked and placed is chosen from said set of interchangeable vacuum leads;
(b) a soak buffer for a pick and place handler, comprising an array of pocket groupings;
wherein each pocket grouping comprises the same pattern of pockets of different shapes and/or sizes to accommodate different semiconductor packages;
whereby package-to package conversion can be achieved by programming an offset into said pick and place handler to cause the pick and place handler to move to a different pocket in each of said pocket groupings;
(c) an input/output shuttle plate, comprising:
(i) a block having a plurality of pocket groupings therein, whereby each pocket grouping consists of a pattern of pockets of different sizes and/or shapes having specific offsets from each other;
two or more alignment hole groupings wherein each alignment hole grouping consists of a pattern of holes having the same offsets from each other as the corresponding pockets within said pattern of pockets;
and a plurality of attachment holes;
and
(ii) a base plate comprising two or more alignment pins and a plurality of attachment means groupings wherein each attachment means grouping consists of a pattern of attachment means having offsets from each other with the same distances as the offsets between corresponding pockets in said pattern of pockets but in the opposite directions from said pockets;
whereby, when a particular alignment hole in each of said alignment hole groupings is fitted onto said alignment pins, the corresponding pocket in each pocket grouping is correctly located for the pick and place handler;
and said attachment holes are aligned with the attachment means in each attachment means grouping corresponding to said pockets;
and
(d) a test arm assembly for a pick and place handler, comprising:
(i) a set of interchangeable vacuum leads having different sizes;
each vacuum lead of said set of interchangeable vacuum leads having a hollow upper cylindrical portion, a hollow lower cylindrical portion, and a flange therebetween;
and
(ii) a set of interchangeable nest pieces each nest piece having a contact area where said nest piece contacts a corresponding semiconductor device for testing.

17 more elements

A method for package-to-package conversion of a pick and place handler, comprising the steps of:

(a) removing a vacuum lead from an input arm assembly having a set of interchangeable vacuum leads;
(b) inserting a different size vacuum lead from said set of interchangeable vacuum leads into said input arm assembly;
(c) removing a block of an input/output shuttle plate from a base plate of said input/output shuttle plate by removing attachment means and lifting said block off of pins on said base plate;
said block comprising a plurality of pocket groupings therein, whereby each pocket grouping consists of a pattern of pockets of different sizes and/or shapes having specific offsets from each other;
said block further comprising a plurality of alignment hole groupings, whereby, when a particular alignment hole in each of said alignment hole groupings is fitted onto said alignment pins, the corresponding pocket in each pocket grouping is correctly located for the pick and place handler;
said base plate comprising a plurality of attachment, whereby when a particular alignment hole in each of said alignment hole groupings is fitted onto said alignment pins, the corresponding attachment means in each attachment means grouping on said base plate is aligned with an attachment hole in said block;
(d) repositioning said block on said base plate such that a selected pocket in each pocket grouping is correctly located for the pick and place handler by fitting the alignment hole in each alignment hole grouping corresponding to said selected pocket onto an alignment pin and fastening said block to said base plate by fastening each of said attachment holes in said block to an attachment means in each of said attachment means groupings corresponding to said selected pocket;
said selected pocket having a semiconductor device therein;
(e) picking said semiconductor device with said input arm assembly, and placing said semiconductor device into a soak buffer having an array of pocket groupings, wherein each pocket grouping consists of a pattern of pockets of different shapes and/or sizes to accommodate different semiconductor packages;
whereby said pick and place handler is caused to place said semiconductor device into the correct pocket of each pocket grouping by programming an offset into the pick and place handler movement;
(f) removing a nest piece and a vacuum lead from a test arm assembly having a set of interchangeable nest pieces and a set of interchangeable vacuum leads;
(g) inserting a different size vacuum lead from said set of interchangeable vacuum leads into said test arm assembly;
and
(h) attaching a different nest piece from said set of interchangeable nest pieces onto said different vacuum lead with vacuum pressure.

11 more elements

Dependencies are inferred from the claim text.

Multi-package conversion kit for a pick and place handler

Life of this patent

Multi-package conversion kit for a pick and place handler

Life of this patent

Abstract

Claims10