Topological global routing for automated IC package interconnect
AssigneeCadence Design Systems, Inc.
InventorsKen Wadland, Glendine Kingsbury
Life of this patent
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AssigneeCadence Design Systems, Inc.
InventorsKen Wadland, Glendine Kingsbury
Estimating the term…
An automated method and system is disclosed to determine an Integrated Circuit (IC) package interconnect routing using a mathematical topological solution. A global topological routing solution is determined to provide singular ideal IC package routing solution. Topological Global Routing provides a mathematical abstraction of the problem that allows multiple optimizations to be performed prior to detailed routing. Preliminary disregard of electrical routing segment width and required clearance allows the global topological solution to be determined quickly. The global topological solution is used in conjunction with necessary design parameters to determine the optimal geometric routing solution. Guide points are determined using the geometric routing solution. A detail router uses the guide points as comers when performing the actual routing.
A method of determining interconnect routing solution comprising the steps of:
A system for determining interconnect routing solution comprising:
A computer usable medium on which is embodied a set of programmed instructions that cause one or more processors to perform a sequence of steps, said steps comprising:
A method of determining interconnect routing solution comprising the steps of:
A system for determining interconnect routing solution comprising:
A computer usable medium on which is embodied a set of programmed instructions that cause one or more processors to perform a sequence of steps, said steps comprising:
Dependencies are inferred from the claim text.