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US 2003/0120017 A1Published application
Room temperature curable organopolysiloxane compositon
AssigneeTaisei Corporation
InventorsTakafumi Sakamoto, Tsuneo Kimura, Yoshihide Wakayama
Life of this patent
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Abstract
A room temperature curable organopolysiloxane composition of the ketone removal type comprising a diorganopolysiloxane having a minimized content of low-molecular-weight organopolysiloxanes as a base polymer, and an alkenoxysilane as a crosslinking agent does emit essentially no low-molecular-weight siloxanes and organic matter with the passage of time after curing and is suitable for use as a sealant in a clean room and as a sealant or adhesive on electrical and electronic parts.
Claims7
A room temperature curable organopolysiloxane composition comprising
- (A) 100 parts by weight of a diorganopolysiloxane end-capped with a hydroxyl, alkoxy or alkenoxy radical and containing up to 0.1% by weight of low-molecular-weight organopolysiloxanes having a vapor pressure of at least 10−12 mmHg at 20° C., and
- (B) 0.5 to 30 parts by weight of a silane compound having a radical of the following general formula (1):
- 10
- wherein R1 and R2 are independently hydrogen or a substituted or unsubstituted monovalent hydrocarbon radical, or a partial hydrolytic condensate thereof.
1 more element
Dependencies are inferred from the claim text.