Copper polishing cleaning solution
OwnerJoseph K. So, Terence M. Thomasinventors
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Abstract
A cleaning solution for removing copper complex residues from the surface of polishing pads and wafer substrates includes an amine pH-adjusting agent, which can be a unidentate or bidentate amine compound or a quartnary ammonium hydroxide compound or an amine including an alcohol group. The cleaning solution also includes an amino acid complexing agent and an inhibitor. In a preferred embodiment, the cleaning solution has a basic pH.
Claims28
A copper polishing cleaning solution for cleaning a copper residue from a metal surface comprising:
- a complexing agent and an inhibitor,
- wherein the complexing agent dissolves the copper residue from the metal surface and forms copper ions in solution, and
- wherein the complexing agent maintains the copper ions in solution and substantially prevents the copper ions from redepositing on the metal surface.
The copper polishing cleaning solution of claim 3, wherein the complexing agent comprises a compound selected from the group consisting of a unidentate amine, a bidentate amine and an amino acid.
A copper polishing cleaning solution comprising:
- an amino acid complexing agent;
- a pH adjusting compound;
- and
- an azole inhibitor.
A copper polishing cleaning solution comprising:
- a complexing agent and an inhibitor,
- wherein the complexing agent has a binding constant with copper of at least about 5 and wherein the complexing agent dissolves the copper residue from the metal surface and forms copper ions in solution, and
- wherein the complexing agent maintains the copper ions in solution and substantially prevents the copper ions from redepositing on the metal surface.
Dependencies are inferred from the claim text.