Turning tool for grooving polishing pad, apparatus and method of producing polishing pad using the tool, and polishing pad produced by using the tool
AssigneeToho Engineering Kabushiki Kaisha
InventorTatsutoshi Suzuki
Life of this patent
Estimating the term…
Abstract
Disclosed is a turning tool for cutting circumferential grooves into a surface of a polishing pad formed of a resin material and utilized for polishing semiconductor devices. The turning tool comprising a cutting part arranged to have a tooth width within a range of 0.005-1.0 mm, a wedge angle within a range of 15-35 degrees, and a front clearance angle within a range of 65-45 degrees. A polishing pad effectively formed by using the turning tool, and an apparatus and a method of producing such a polishing pad by utilizing the turning tool are also disclosed.
Claims40
A turning tool for cutting circumferential grooves into a surface of a polishing pad formed of a resin material and utilized for polishing semiconductor devices, said turning tool comprising:
- a cutting part arranged to have a tooth width within a range of 0.005-1.0 mm, a wedge angle within a range of 15-35 degrees, and a front clearance angle within a range of 65-45 degrees.
A method of producing a polishing pad made of a resin material, comprising the steps of:
- positioning a turning tool comprising a cutting part arranged to have a tooth width within a range of 0.005-1.0 mm, a wedge angle within a range of 15-35 degrees, and a front clearance angle within a range of 65-45 degrees, relative to a base for said polishing pad formed of said resin material;
- rotating said cutting part of said turning tool relative to said base for said polishing pad about an axis of said base for said polishing pad, for cutting circumferential grooves into a surface of said base such that radially inner most one of said circumferential grooves has a radius of curvature of 10 mm or smaller.
A polishing pad comprising:
- a base made of a resin material;
- and
- circumferential grooves open in a surface of said base, said grooves having a width within a range of 0.005-1.0 mm, a depth of 0.2-2.0 mm, and a pitch of 0.2-2.0 mm,
- wherein radially inner most one of said circumferential grooves has a radius of curvature of not larger than 10 mm.
A machine for grooving a base for a polishing pad made of a resin material, said machine comprising:
- a bed;
- a platen including a hollow shaft member supported by said bed via bearing so that said hollow shaft member is rotatably about a C-axis which is perpendicular to said bed;
- a suction plate fixed to one of opposite axial end portions of said hollow shaft member remote from said bed and formed with a plurality of through holes arranged evenly over an entire area thereof for attracting the base for the polishing pad to be placed on said suction plate;
- drive mechanism for rotating said platen about said C-axis and for positioning said platen at a suitable angular position;
- a gate-shaped column having two legs which are opposed to each other with a spacing therebetween and a cross rail extending between and being perpendicular to said two legs, said gate-shaped column being movable in a direction of an X-axis with said cross rail extending across said platen;
- at least one saddle mounted on said cross rail so as to be movable in a direction of a Y-axis extending along said cross rail;
- a tool rest mounted on said saddle so as to be independently reciprocally movable in a direction of a Z-axis, said tool rest adapted to detachably hold a fixed tool comprising a turning tool comprising a cutting part arranged to have a tooth width within a range of 0.005-1.0 mm, a wedge angle within a range of 15-35 degrees, and a front clearance angle within a range of 65-45 degrees;
- drive motors for moving and positioning said platen, said column and said saddle and said tool rest;
- and
- a numerical control apparatus totally control an operation of said drive motor,
- wherein said hollow shaft member of said platen is connectable to an air suction device so as to attract said base for said polishing pad on said suction plate by a suction force applied from said air suction device to said base for said polishing pad, and
- wherein said machine being operable to cut by said turning tool a multiplicity of generally concentric annular grooves into a surface of said base for said polishing pad with said base for said polishing pad being attracted on said suction plate.
Dependencies are inferred from the claim text.