Low impedance, high-power socket and method of using

A power socket comprising:

• a major planar upper surface and a major planar lower surface;
• a power terminal spaced apart from a ground terminal, wherein the power terminal includes a first cross-sectional area;
• a first plurality of input/output (I/O) pin sockets disposed at the major planar upper surface, wherein I/O pin socket of the plurality of I/O pin sockets includes a second cross-sectional area that is smaller than the first cross-sectional area;
• a capacitor that has capacitor plates vertically oriented to the major planar surface;
• and
• a second plurality of electrical bumps disposed at the major planar lower surface.

A power socket comprising:

• a plurality of input/output (I/O) pin sockets embedded in a socket platform, wherein the socket platform includes a major planar surface;
• a power terminal embedded in the socket platform;
• a ground terminal embedded in the socket platform;
• and
• a capacitor embedded in the socket platform, wherein the capacitor includes a power plate and a ground plate, and wherein the power plate and the ground plate are configured orthogonal to the major planar surface.

A method of operating a device, comprising:

• passing a current through a power socket, wherein an alternating first current passes in a first direction through a first capacitor plate that is configured in a plane collinear with the first direction;
• wherein a direct second current passes in the first direction through a power terminal;
• wherein the alternating first current discharges into a second capacitor plate in a second direction that is substantially opposite to the first direction, wherein the second capacitor plate is spaced apart and immediately adjacent the first capacitor plate;
• and
• wherein the direct second current passes to ground through a ground terminal in the second direction.