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US 2003/0119340 A1Published application
Clip-type lead frame for electrically connecting two substrates or devices
AssigneeMitsubishi Denki Kabushiki Kaisha
InventorsTakakazu Fukumoto, Hajime Maeda, Tetsuya Takeoka
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Abstract
A subject of the present invention is to provide a clip-type lead frame having flexibility against a board thickness variation caused by not only an uneven product quality but also several different thick type products. To this end, the provided clip-type lead frame has a height adjustable means at lead pins corresponding to upper or/and lower side connection pads of the semiconductor device or the sub-board.
Claims8
A clip-type lead frame for mounting a first substrate with connection pads on its peripheral portion on a second substrate, comprising:
- a support made of electrically insulative material;
- and
- a first pin and a second lead pin made of electrically conductive material and mounted in the support so that an upper portion of first lead pin opposes to an upper portion of the second lead pin with leaving a gap therebetween for clipping and holding the first substrate, wherein at least one of the first and second lead pins has a mechanism for adjusting the gap between the opposing upper portions of the first and second pins.
Dependencies are inferred from the claim text.