Transmission line structure and method of signal propagation
AssigneeIntel Corporation
InventorDavid GenLong Chow
Life of this patent
Estimating the term…
Abstract
A transmission line structure comprises a plurality of conductive lines over an insulating layer. With three conductive lines, a center conductive line is disposed between the outer conductive lines to define a gap distance therebetween that is less than their height. In a further aspect, a conductive layer (e.g., a ground plane) contacts the insulating layer on a side thereof opposite the plurality of conductive lines. A ratio for the height of the conductive lines relative to the distance therebetween is kept greater than another ratio for the width of the center conductor relative to the thickness of the insulating layer.
Claims44
An apparatus comprising:
- dielectric;
- and
- conductive material on the dielectric;
- the conductive material defining a plurality of spaced lines, opposing sidewalls of the spaced lines defining a distance therebetween less than a height of the conductive material.
A transmission line structure comprising:
- a ground plane;
- a dielectric over the ground plane;
- a plurality of conductive lines over the dielectric, each conductive line comprising:
- opposite primary faces, and
- opposite secondary faces defining their height,
- one of the secondary faces in contact with the dielectric to support the conductive line relative thereto;
- primary faces of adjacent conductive lines defining a gap therebetween, the gap distance less than the height of the conductive lines.
An integrated circuit comprising:
- a dielectric having a surface;
- a plurality of conductive lines against the dielectric for signal propagation, each conductive line comprising:
- a first edge against the surface of the dielectric;
- opposing sidewalls extending away from the dielectric, and
- a second edge opposite the first edge to define a height;
- the sidewall of one of the conductive lines separated from the sidewall of an adjacent conductive line of the plurality by a distance less than the height.
A method of routing a signal across a substrate, comprising:
- driving a plurality of conductive lines that are disposed side-by-side with a signal;
- and
- receiving the signal from one of the plurality of conductive lines at an end opposite its driven end, the one conductive line between adjacent conductive lines within the plurality.
A computer system having a processor comprising:
- a substrate with an insulating layer;
- and
- a plurality of conductive lines in contact with the insulating layer,
- a center conductive line disposed between two other conductive lines of the plurality to define a gap distance therebetween,
- the gap distance less than a height of the conductive lines.
Dependencies are inferred from the claim text.