Die attachment with reduced adhesive bleed-out

A method for manufacturing a semiconductor integrated circuit package whereby integrated circuit adhesive does not spread onto bond finger connections of the package, which method comprises:

• providing on selected areas of an integrated circuit carrier a photocurable adhesive composition that possesses dual curing characteristics;
• placing an integrated circuit die over and in contact with said adhesive composition and creating an adhesive fillet along the die edge;
• exposing said adhesive to actinic radiation;
• and then post-baking in order to cure the adhesive composition.

An adhesive composition that exhibits dual curing characteristics which comprises:

• 1) a resin component comprising:
• a. an epoxy component including at least one polyepoxide resin curable by heat;
• b. an olefinically unsaturated monomer component including at least one polyolefinically unsaturated monomer curable by actinic radiation;
• and
• c. at least one cyanate ester;
• 2) at least one photoinitiator;
• 3) at least one organic peroxide;
• and
• 4) at least one heat activated curing agent being selected from the group consisting of organo-metal compounds, inorganic metal salts, phenolic compounds, solutions of organo-metal compounds in phenolic compounds and mixtures thereof.