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US 2003/0118797 A1Published application
Structure for multi-layer conductive via and circuit and method for making same
OwnerRobin Fluman, Ken Ganninventors
Life of this patent
Estimating the term…
Abstract
A multi-layer conductive via structure and multi-layer circuit structure containing such multi-layer via structure are described along with the methods for making the structures. The structures include conductive material filled opening(s) located within flexible substrate layers that are supported by an adhesive layer.
Claims32
A multi-layer conductive via comprising:
- a) a first layer of flexible substrate;
- b) a conductive ink overlying said first layer;
- c) an adhesive layer having an opening therein overlying said conductive ink;
- d) a second layer of flexible substrate having an opening therein overlying said adhesive layer such that said openings are aligned with one another;
- and
- e) a conductive material layer filling said aligned openings.
3 more elements
A multi-layer circuit comprising:
- a) a first substrate layer;
- b) a conductive circuit formed on said substrate layer using a conductive ink;
- c) an adhesive layer having at least one opening formed therein overlying said conductive circuit on said substrate;
- d) a flexible layer having at least one opening therein overlying said adhesive layer such that at least one of said openings in said flexible layer is aligned with at least one of said openings in said adhesive layer;
- e) a second conductive circuit formed on said flexible layer wherein said circuit lies adjacent to at least one set of aligned openings;
- and
- f) a conductive material layer filling said aligned openings.
4 more elements
A method for making a multi-layer conductive via comprising the steps of:
- a) forming a first flexible layer;
- b) applying a conductive ink to said first layer;
- c) applying an adhesive layer having at least one opening therein over said first layer and said conductive ink such that said opening in said adhesive layer overlies said conductive ink;
- d) applying a second flexible layer having at least one opening therein over said adhesive layer such that at least one opening in said second flexible layer overlies at least one opening in said adhesive layer;
- and
- e) filling said aligned openings with a conductive material layer.
3 more elements
A method for making a multi-layer circuit comprising the steps of:
- a) forming a first substrate layer;
- b) forming a conductive circuit on said substrate layer using a conductive ink;
- c) applying an adhesive layer having at least one opening therein over said substrate layer and conductive circuit such that the opening in said adhesive layer overlies said conductive circuit;
- d) applying a flexible layer having at least one opening therein over said adhesive layer such that at least one opening in said adhesive layer and at least one opening in said flexible layer are aligned with one another;
- e) forming a second conductive circuit on said flexible layer such that said second conductive circuit lies adjacent to at least one set of aligned openings in said adhesive and flexible layers;
- and
- f) filling said aligned openings with a conductive material.
4 more elements
Dependencies are inferred from the claim text.