Planarization of ceramic substrates using porous materials

Abstract

This invention provides a concept of using porous materials on ceramic substrate planarization. This planarized substrate comprises a ceramic substrate, a buffer layer, and a nanostructure layer. The ceramic substrate can enhance the structural strength and surface-mount capability. The buffer layer provides the adhesion between a substrate and a nanostructure layer. Nanostructure layer provides the required surface smoothness of the ceramic substrates for performing thin-film processing techniques and enhancing adhesion for metallization and electronic materials. This layer also provides required properties for integrating electronic such as thermal conductivity, electrical insulation, dielectric, etc.

Dependencies are inferred from the claim text.