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US 2003/0118685 A1Published application
Device for sticking protective sheet on substrate surface
AssigneeNEC Electronics Corporation
InventorShinya Takita
Life of this patent
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Abstract
The device for sticking a protective sheet on the substrate surface according to the present invention comprises a sticking unit for sticking a surface protective sheet on a semiconductor wafer, and a thermocompression and cutting unit which conducts thermocompression bonding for the periphery of the semiconductor wafer and cuts the surface protective sheet along the edge of the semiconductor wafer.
Claims5
A device for sticking a protective sheet on the substrate surface comprising;
- a sticking unit for sticking a surface protective sheet on a semiconductor wafer, and a thermocompression and cutting unit which conducts thermocompression bonding for the periphery of said semiconductor wafer and cuts said surface protective sheet along the edge of said semiconductor wafer.
Dependencies are inferred from the claim text.