Semiconductor device and a method of manufacturing the same

A semiconductor device in which a mounting portion having a projecting cross section is formed on a case body which is applied to a part mounting surface of a substrate on which a semiconductor chip is mounted, and a recessed portion of a metal-made auxiliary piece for increasing a planar dimension of the case body is fitted on the mounting portion having the projecting cross section such that the auxiliary piece can be mounted on the case body in a replaceable manner.

A semiconductor device in which the semiconductor device includes a resin-made case body which is applied to cover a part mounting surface of a substrate on which a semiconductor chip is mounted, and an area of the substrate is equal to or less than one half of an area of the case body.

A method of manufacturing a semiconductor device comprising a step in which when a resin-made case body for covering a part mounting surface of a substrate on which semiconductor chip is mounted is molded, a mold in which a depth of a cavity of a lower mold which forms an inner side face of the case body is set larger than a depth of a cavity of an upper mold for forming an outer front surface of the case body is used.

A semiconductor device comprising a case body, a groove formed on one face of the case body, a substrate which is mounted in the inside of the groove in a state that the substrate faces a part mounting surface, and a plurality of semiconductor chips which are mounted on a part mounting surface,

• wherein, with respect to the groove and the substrate, a length along the longitudinal direction of the case body is set shorter than a total length in the longitudinal direction of the case body, and
• wherein, with respect to the groove and the substrate, both corner portions positioned at the center side of the case body have corners thereof eliminated thus forming first chamfered portions.

A semiconductor device comprising a case body, a groove formed on one face of the case body, a substrate which is mounted in the inside of the groove in a state that the substrate faces a part mounting surface, and a plurality of semiconductor chips which are mounted on a part mounting surface,

• wherein, with respect to the groove and the substrate, a length along the longitudinal direction of the case body is set shorter than a total length in the longitudinal direction of the case body, and
• wherein, with respect to the groove and the substrate, indentations and projections are formed on at least a portion of a side positioned at the center side of the case body.

A semiconductor device comprising a case body, a groove formed on one face of the case body, a substrate which is mounted in the inside of the groove in a state that the substrate faces a part mounting surface, and a plurality of semiconductor chips which are mounted on a part mounting surface,

• wherein, with respect to the groove and the substrate, a length along the longitudinal direction of the case body is set shorter than a total length in the longitudinal direction of the case body, and
• wherein the plurality of semiconductor chips are arranged in the direction which crosses the longitudinal direction of the case body.