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US 2003/0117778 A1Published application
Modular jack
OwnerIosif Korsunsky, Kevin E. Walker +1inventors
InventorsIosif Korsunsky, Kevin E. Walker, James H. Hyland
Life of this patent
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Abstract
A modular jack (1) assembled on a mother board comprises an insulative housing (2) with a receiving space (25, 26), a plurality of terminals (3, 4) received in the receiving space, and an electronic component (5, 6) assembled in the insulative housing for eliminating noise. The electronic component comprises a plurality of upper contacts (501, 601) for connecting with corresponding terminals and a plurality of lower contacts (503, 603) for connecting with the mother board.
Claims5
A modular jack mounted on a mother board, comprising:
- an insulative housing defining a receiving space;
- a terminal module received in the receiving space and comprising a plurality of terminals, each terminal comprising a mounting portion, an inclined contacting portion extending from a front end of the mounting portion and a tail portion extending rearwardly from a rear end of the mounting portion;
- and
- an electronic component assembled in the insulative housing to eliminate noise and comprising a plurality of upper contacts for connecting with the tail portions of the terminals, and a plurality of lower contacts for connecting with the mother board.
1 more element
A modular jack assembly comprising:
- an insulative housing defining upper and lower receiving spaces and a rear receiving space therein;
- upper and lower terminal modules respectively disposed in the corresponding upper and lower receiving spaces with a plurality of contacts thereof;
- a pair of electronic components retainably spatially located in said rear space, each of said electronic components including a base with a filter printed circuit board and magnetic coil, a plurality of upper contacts located on an upper portion of the base and engaged with the corresponding contacts, respectively, and a plurality of lower contacts located on a lower portion of the base and extending downwardly beyond a bottom face of the assembly to assemble to a main printed circuit board on which the assembly is seated.
Dependencies are inferred from the claim text.